Texas Instruments has tasked our team with creating an accurate, repeatable and reproducible way (within ±500 microns) to measure the warpage of silicon wafers. Since these wafers are extremely fragile it is important that they are not damaged or contaminated. To accomplish this, our team used a digital micrometer stage lifter with a laser attached to measure the warpage. This ensures the wafer is not contacted during the measurement. After testing we have shown that our device meets the measurement requirements given to us by Texas Instruments.